Quectel New Product Release – FGMC63N
MCU Wi-Fi 6/6E & BLE 5.4 FGMC63N Wi-Fi 6/6E and BLE 5.4 module LGA form factor Dimensions: 16.0 mm x 13.0 mm x 1.7 mm Approx. 0.76 g Operating temperature…
MCU Wi-Fi 6/6E & BLE 5.4 FGMC63N Wi-Fi 6/6E and BLE 5.4 module LGA form factor Dimensions: 16.0 mm x 13.0 mm x 1.7 mm Approx. 0.76 g Operating temperature…
MCU Wi-Fi 6/6E & BLE 5.4 FGMC62N Wi-Fi 6/6E and BLE 5.4 module LGA form factor Dimensions: 16.0 mm x 13.0 mm x 1.7 mm Approx. 0.76 g Operating temperature…
LTE SC200U smart module series Multi-mode smart LTE module with Wi-Fi and Bluetooth LCC + LGA package Dimensions: 40.5 mm x 40.5 mm x 2.85 mm Max. data rates of…
Transcend Information, Inc. (Transcend®), a global leader in digital storage solutions, today announced the launch of its CFexpress 830 Type B memory card. Built on the latest CFexpress 4.0 specification…
Today’s wireless products juggle multiple cellular bands alongside 5 GHz traffic for backhaul and throughput. That mix only works when signals are cleanly routed, losses stay low, and each path…
LR700A integrated smart GNSS receiver Integrated GNSS receiver Ø 220 mm x 149 mm 2.1 kg Operating temperature range: -40 °C to +85 °C GPS + GLONASS + Galileo +…
LTE Cat 1 bis EG800AK series LTE Cat 1 bis module LGA form factor 17.7mm x 15.8mm x 2.4mm 1.35g Max. data rates of 10Mbps DL / 5Mbps UL Extended…
HCM512S MCU BLE 5.4 module BLE 5.4 module 16.6 mm x 11.2 mm x 2.1 mm LCC form factor Operating temperature range: -40°C to +85°C The HCM512S is a high-performance…
SH603ZA-AP smart module New generation smart module Linux (Kernel 6.10)/ Android 14/ Debian LCC + LGA form factor Dimensions: 44.0 mm x 43.0 mm x 2.9 mm Operating temperature: -25…
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announced the launch of its EG800AK-JP LTE Cat 1 bis module at CEATEC 2025, taking place October 14–17 in Makuhari Messe, Japan (Booth…