Quectel New Product Release – FCM365X
Wi-Fi & Bluetooth FCM365X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 module LCC and LGA form factor IEEEE 802.15.4 (Thread, Zigbee) 1.51g 25.5mm x 18.0mm x 3.16mm Operating temperature range…
Wi-Fi & Bluetooth FCM365X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 module LCC and LGA form factor IEEEE 802.15.4 (Thread, Zigbee) 1.51g 25.5mm x 18.0mm x 3.16mm Operating temperature range…
We have uploaded a new video to our Youtube Channel This video details the Quectel EG950A-EL Module. Quectel EG950A is a series of LTE Cat 4 module optimized specially for…
MCU Bluetooth HCM213S BLE 6.0 module LCC form factor 18.0 mm x 18.0 mm x 2.4 mm Operating temperature of -40 °C to +105 °C HCM213S is a high-performance MCU…
We have uploaded a new video to our Youtube Channel This video details the Quectel EM060K Module. Quectel EM060K is a series of LTE Advanced Category 6 module. Adopting the…
Transcend Information, Inc. (Transcend®), a global leader in digital storage solutions, announced the launch of the RDE3 microSD Express high-speed card reader, engineered for high-performance applications. Featuring a USB 3.2…
150W and 250W point-of-load DC/DC converters provide high efficiency across all operating conditions, including up to 96% at 36V input to 12V output conversion. Ultra-wide 5-59V input and 2-30V output…
We have uploaded a new video to our Youtube Channel This video details the Quectel KCMA32S Module. KCMA32S is a high-performance MCU Zigbee and BLE module launched by Quectel. It…
Due to the continued increase in laser power, particularly in industries such as manufacturing, medicine, and defense, optics with the lowest possible absorption are becoming increasingly important. This helps prevent…
We have uploaded a new video to our Youtube Channel This video details the Quectel LC29H Module. LC29H is a series of dual-band, multi-constellation GNSS modules that support the concurrent…
The new TM14R1_3UP series, an innovative 1W isolated and unregulated DC-DC converter designed to meet the increasing demand for ultra-miniaturization and high reliability in modern electronic assemblies. The standout feature…