Quectel New Product Release – SP895BD-AP
SP895BD-AP smart module
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm’s flagship IoT chipset CQ8750-S, with built-in maximum octa-core high-performance Oryon CPU, Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Hexagon™ DSP, and Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.
A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
Key features
- Oryon CPU
- Adreno™ 830 GPU
- Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Spectra™ ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
