Quectel are happy to announce the launch of their FGS060N Wi-Fi & Bluetooth

• Wi-Fi 6, BLE (Bluetooth 5.2) and 802.15.4 module
• Max. data rate of 600.4 Mbps
• LGA form factor
• 14.0 mm × 13.0 mm × 2.0 mm
• 0.7 g
• Operating temperature range of -40°C to +85°C

Module FGS060N
Chipset – IW612
WLAN Protocol – 802.11a/ b/ g/ n/ ac/ ax
Wi-Fi Frequency Band – 2.4/ 5 GHz
Wi-Fi Antenna – 1 × 1
Wi-Fi Modulation – DSSS, CCK, BPSK, QPSK, DBPSK, DQPSK, 16QAM, 64QAM, 256QAM, 1024QAM, OFDMA
Bluetooth Protocol – Bluetooth 5.2
Thread Protocol – 802.15.4
Operating Mode – STA/ AP

Interface

Wi-Fi: SDIO 3.0 × 1
Bluetooth: UART × 1
Thread: SPI × 1
Security – WPA2, WPA3
Max. Physical Rate – 600 Mbps
Operating Temperature Range -40 °C to +85 °C
Certification Regulatory: CE/ FCC/ IC/ RCM
Project Stage – CS

FGS060N is a high-performance Wi-Fi 6, Bluetooth 5.2 and 802.15.4 module in LGA package. In IEEE 802.11ax mode, the WLAN operation supports MCS 0–MCS 11 rates in an 80 MHz bandwidth with 1024QAM supported. It is designed with a reliable SDIO 3.0 interface to provide WLAN capability.

With an ultra-compact size of 14.0 mm × 13.0 mm × 2.0 mm, FGS060N optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications. Surface-mount Technology (SMT) makes FGS060N an ideal solution for durable and rugged designs. Its low profile and small LGA package ensure easy embedding into size-constrained applications and provide reliable connectivity.

The advanced package and laser-engraved label with improved heat dissipation and indelible markings allow for large-scale automated manufacturing, effectively optimizing production costs and efficiency. Additionally, its compact size and wide operating temperature range, make FGS060N suitable for a variety of smart home and industrial applications.