Quectel Wireless Solutions, an end-to-end global IoT solutions provider, has unveiled the FGMC63N, the industry’s first tri-band MCU Wi-Fi 6E module, at CES in Las Vegas. Supporting operation across the 2.4GHz, 5GHz, and 6GHz bands, the FGMC63N delivers true tri-band capability in a compact, integrated design, addressing a longstanding gap in the market and enabling customers to take full advantage of next-generation Wi-Fi performance in MCU-based products. Alongside the FGMC63N, Quectel also introduced the pin-compatible FGMC62N, a dual-band Wi-Fi 6 module supporting the 2.4GHz and 5GHz frequency ranges. Together, these modules allow for a single design that can support tri-band Wi-Fi 6E or dual-band Wi-Fi 6.

“We’re delighted to bring the FGMC62N and FGMC63N to market, bringing low power consumption and multi-band Wi-Fi and BLE 5.4 modules to the market,” said Delbert Sun, Deputy General Manager, Quectel Wireless Solutions. “With the FGMC63N, it’s great to be able to introduce a tri-band MCU Wi-Fi 6E module to meet the market’s needs for this functionality. We look forward to supporting customers with these versatile, power-efficient, and compact Wi-Fi 6 and Bluetooth modules.”

Both the FGMC62N and the FGMC63N are based on the Infineon AIROC™ CYW55912 and CYW55913 connected MCUs, respectively, and offer very low power consumption with support for IEEE Wi-Fi and Bluetooth Low Energy 5.4 protocols. The modules feature a high-performance ARM Cortex-M33 processor and have memory of 768KB SRAM, 2MB ROM, and 4MB flash. In addition, the modules comply with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards utilizing an AES-128 encryption algorithm. Quectel also provides comprehensive support via the Infineon software development kit, helping customers streamline integration and reduce time to market.

“As an IoT leader with more than a billion Wi-Fi devices deployed worldwide, Infineon is committed to driving decarbonization and digitalization with low-power solutions that connect products to the cloud,” said Sivaram Trikutam, Senior Vice President of Wi-Fi Products, Infineon Technologies. “The combination of our easy-to-use software, along with the industry’s best wireless performance and lowest power consumption, allows best-in-class IoT products to be built using the AIROC CYW5591x Connected MCU family. This flexible device family can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications.”

Both the tri-band MCU Wi-Fi 6E FGMC63N module and the dual-band Wi-Fi 6 FGMC62N offer multiple interfaces, including SDIO, UART, SPI, I2C, TDM, PWM, ADC, DMIC, and analog MIC. The modules also feature many low-power consumption modes and a keep-alive mechanism, which provides flexibility and versatility for a range of applications, particularly in smart homes and industrial IoT.