Quectel are happy to announce the launch of their FCS950R Wi-Fi & Bluetooth

• Wi-Fi 5 and Bluetooth 4.2 module
• Max. data rate of 150Mbps
• LCC form factor
• 12.0mm × 12.0mm × 2.35mm
• 0.58g
• Operating temperature range of -20°C to +70°C

Module FCS950R

Chipset Realtek – RTL8821CS-CG
WLAN Protocol – IEEE 802.11a/ b/ g/ n/ ac
Wi-Fi Frequency Range – 2.4 GHz/ 5GHz
Wi-Fi Antenna – 1 × 1 (1T1R)
Wi-Fi Modulation – DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM
Working Mode – AP, STA, AP+STA
Interface Wi-Fi: SDIO
BT: UART,PCM

Encryption Mode – WPA3
Maximum Data Rate – 433 Mbps
Operating Temperature Range -20 °C ~ +70 °C
Certification – FCC / IC / CE / RCM / SRRC
Product Stage – CS

FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module in LCC package. It can be used to establish WLAN and Bluetooth connections. In IEEE 802.11ac mode, it delivers maximum data rate up to 433.3 Mbps.

With an ultra-compact size of 12.0mm × 12.0mm × 2.35mm, FCS950R optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications. Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs.

The low profile and small size of LCC package ensure that FCS950R can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency.

Designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission. This, coupled with its compact size and wide operating temperature range, FCS950Rcan meet various needs of commercial applications.