Quectel are happy to announce the launch of their FCU741R Wifi 4 Module

• Wi-Fi 4 module
• Max. data rate of 150Mbps
• LCC form factor
• 13.0mm × 12.2mm × 2.25mm
• 0.68g
• Operating temperature range of -20°C to +70°C

Module – FCU741R

Chipset – Realtek RTL8731BU-CG
WLAN Protocol – IEEE 802.11a/ b/ g/ n
Wi-Fi Frequency Range – 2.4 GHz/ 5GHz
Wi-Fi Antenna – 1 × 1 (1T1R)
Wi-Fi Modulation – CCK/ BPSK/ QPSK/ DQPSK/ 16QAM/ 64QAM
Working Mode – AP, STA, AP+STA
Interface Wi-Fi: USB 2.0
Encryption Mode – WPA3
Maximum Data Rate – 150 Mbps
Operating Temperature Range -20 °C ~ +70 °C
Certification – FCC / IC / CE / RCM / SRRC
Product Stage – CS

HCM010S is a high-performance MCU Bluetooth module launched by Quectel. It boasts a ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. HCM010S is in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

HCM010S supports up to 20 GPIOs for UART, SPI, I2C and other functions in QuecOpen® solution, features superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.

HCM010S supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.