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LTG0402 LTG Thermal Management Materials Evaluation Board
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Description
LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.
Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0402, 0603, and 0805) as well as custom sizes.
- High thermal conductivity
- Low capacitance
- High insulation resistance
- Dimensions – 1.0 x 0.5 mm (0402), 1.6 x 0.8 mm (0603)
- Height – 0.8 mm
- Substrate Material – Silicon (150 W/mK)
- Termination Material – Copper with/without solder
- Thermal Resistance – 30 K/W (0402), 15 K/W (0603)
- Parasitic Capacitance – 1.40 pF (0402), 3.85 pF (0603)
- Isolation Resistance – 2.1 GΩ (0402), 0.69 GΩ (0603)
- Operating Temperature Range – -55 ◦C to +150 ◦C
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Type
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Description
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Category
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Development Boards, Kits, Programmers
Evaluation Boards
Evaluation and Demonstration Boards and Kits
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Manufacturer
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Lotus Microsystems
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Series
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LTG
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Packaging
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Case
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Part Status
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Active
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Type
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Materials
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Function
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Thermal Management
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Embedded
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No
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Utilized IC / Part
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LTG0402
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Primary Attributes
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Thermal
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Contents
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Board(s)
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Note
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–
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